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The development of electric coupling for RF IC package substrate
Qi Liu, Huimei Wang, Weidong Liu, Xiaolong Wang, Rui Zhang (2017). The development of electric coupling for RF IC package substrate. , DOI: 10.1109/icept.2017.8046401.
Article146 days agoInternational Symposium on Electromachining
Bert Lauwers, Jean-pierre Kruth, Weidong Liu, Wesley Eeraerts, Benny Schacht, Philip Bleys (2004). International Symposium on Electromachining. Journal of Materials Processing Technology, 146, pp. 347-352
Article127 days agoEDM of Si3N4-based electrical conductive ceramics
Weidong Liu, Karel Brans, Jean-pierre Kruth, Bert Lauwers (2007). EDM of Si3N4-based electrical conductive ceramics. , pp. 11-16
Article127 days agoInternational Symposium on Electromachining
Bert Lauwers, Jean-pierre Kruth, Weidong Liu, Wesley Eeraerts, Benny Schacht, Philip Bleys (2004). International Symposium on Electromachining. , 146
Article77 days ago