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Get Free AccessRF signal is ease to be interfered, which makes the signal of transmitting and receiving impure to impact on wireless communication. It is not to be ignored for interfering between transceiver signals in package of transceiver, thus, insulating enough must be taken. In addition, the mount of noise introduced through a main interference source being from contribution of digital signal continuously jumping will couple into RF transceiver signals, If do nothing, the disastrous consequences will arrive. In this paper, noises being from two structure of package substrate are discussed. Besides, some suggestions are provided to obtain suppression of noises.
Qi Liu, Huimei Wang, Weidong Liu, Xiaolong Wang, Rui Zhang (2017). The development of electric coupling for RF IC package substrate. , DOI: 10.1109/icept.2017.8046401.
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Type
Article
Year
2017
Authors
5
Datasets
0
Total Files
0
Language
English
DOI
10.1109/icept.2017.8046401
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