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On the strength and fracture toughness of an additive manufactured CrCoNi medium-entropy alloy
Punit Kumar, Matthew Michalek, David H. Cook, Sheng Huang, Kwang Boon Lau, Pei Wang, Mingwei Zhang, Andrew M. Minor, Upadrasta Ramamurty, Robert O. Ritchie (2023). On the strength and fracture toughness of an additive manufactured CrCoNi medium-entropy alloy. Acta Materialia, 258, pp. 119249-119249, DOI: 10.1016/j.actamat.2023.119249.
Article185 days agoOn the strength and fracture toughness of an additive manufactured CrCoNi medium-entropy alloy
Punit Kumar, Matthew Michalek, David H. Cook, Sheng Huang, Kwang Boon Lau, Pei Wang, Mingwei Zhang, Andrew M. Minor, Upadrasta Ramamurty, Robert O. Ritchie (2023). On the strength and fracture toughness of an additive manufactured CrCoNi medium-entropy alloy. Acta Materialia, 258, pp. 119249-119249, DOI: 10.1016/j.actamat.2023.119249.
Article185 days agoConductive Ink with Circular Life Cycle for Printed Electronics
Junpyo Kwon, Christopher DelRe, Philjun Kang, Aaron Hall, Daniel P. Arnold, Ivan Jayapurna, Le Ma, Matthew Michalek, Robert O. Ritchie, Ting Xu (2022). Conductive Ink with Circular Life Cycle for Printed Electronics. Advanced Materials, 34(30), DOI: 10.1002/adma.202202177.
Article145 days ago