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Get Free AccessChemical mechanical polishing (CMP) offers a promising pathway to smooth third-generation semiconductors. However, it is still a challenge to reduce the use of additional oxidants or/and energy in current CMP processes. Here, a new and green atomically smoothing method: Piezocatalytic-CMP (Piezo-CMP) is reported. Investigation shows that the Piezo-CMP based on tetragonal BaTiO
Tao Hu, Jinxi Feng, Wen Yan, Shuanghong Tian, Jingxiang Sun, Xiaosheng Liu, Di Wei, Ziming Wang, Yang Yu, Jason Chun‐Ho Lam, Shaorong Liu, Zhong Lin Wang, Ya Xiong (2023). Piezocatalysis for Chemical–Mechanical Polishing of SiC: Dual Roles of t‐BaTiO<sub>3</sub> as a Piezocatalyst and an Abrasive. , 20(21), DOI: https://doi.org/10.1002/smll.202310117.
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Type
Article
Year
2023
Authors
13
Datasets
0
Total Files
0
Language
en
DOI
https://doi.org/10.1002/smll.202310117
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