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  5. Understanding Metal Deposition in Solid Electrolytes Due to Mixed Ionic-Electronic Conduction

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Article
en
2020

Understanding Metal Deposition in Solid Electrolytes Due to Mixed Ionic-Electronic Conduction

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en
2020
Vol MA2020-02 (5)
Vol. MA2020-02
DOI: 10.1149/ma2020-025972mtgabs

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Gerbrand Ceder
Gerbrand Ceder

University of California, Berkeley

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Qingsong Tu
Tan Shi
Gerbrand Ceder

Abstract

The effect of ionic and electronic conductivity in the solid electrolytes (SE) on metal (such as Li, Na) deposition and dendrite propagation in the SE are investigated. A new framework for metal formation inside defects (such as voids, grain boundaries) in the SE due to the electronic conductivity of the SE is established. We find that for typical SE material (with ionic conductivity ~0.1mS/cm and electronic conductivity ~10^-5 mS/cm) isolated voids in the SE that are close enough to the anode side (~0.1 um) may be filled in with metal within several minutes under typical galvanostatic charging condition (with current density 0.1~1mA/cm^2). Continuous deposited metal in the voids may lead to fracture of the SE, which triggers mode II dendrite growth (isolated dendrites growth in the SE). We will propose two strategies to prevent metal deposition in the SE.

How to cite this publication

Qingsong Tu, Tan Shi, Gerbrand Ceder (2020). Understanding Metal Deposition in Solid Electrolytes Due to Mixed Ionic-Electronic Conduction. , MA2020-02(5), DOI: https://doi.org/10.1149/ma2020-025972mtgabs.

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Publication Details

Type

Article

Year

2020

Authors

3

Datasets

0

Total Files

0

Language

en

DOI

https://doi.org/10.1149/ma2020-025972mtgabs

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