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  5. High-temperature electronic devices enabled by hBN-encapsulated graphene

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Article
English
2019

High-temperature electronic devices enabled by hBN-encapsulated graphene

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English
2019
Applied Physics Letters
Vol 114 (12)
DOI: 10.1063/1.5088587

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Konstantin ‘kostya’  Novoselov
Konstantin ‘kostya’ Novoselov

The University of Manchester

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Makars Šiškins
Ciaran Mullan
Seok‐Kyun Son
+6 more

Abstract

Numerous applications call for electronics capable of operation at high temperatures where conventional Si-based electrical devices fail. In this work, we show that graphene-based devices are capable of performing in an extended temperature range up to 500 °C without noticeable thermally induced degradation when encapsulated by hexagonal boron nitride (hBN). The performance of these devices near the neutrality point is dominated by thermal excitations at elevated temperatures. Non-linearity pronounced in electric field-mediated resistance of the aligned graphene/hBN allowed us to realize heterodyne signal mixing at temperatures comparable to that of the Venus atmosphere (∼460 °C).

How to cite this publication

Makars Šiškins, Ciaran Mullan, Seok‐Kyun Son, Jun Yin, Kenji Watanabe, Takashi Taniguchi, Davit Ghazaryan, Konstantin ‘kostya’ Novoselov, Artem Mishchenko (2019). High-temperature electronic devices enabled by hBN-encapsulated graphene. Applied Physics Letters, 114(12), DOI: 10.1063/1.5088587.

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Publication Details

Type

Article

Year

2019

Authors

9

Datasets

0

Total Files

0

Language

English

Journal

Applied Physics Letters

DOI

10.1063/1.5088587

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