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Get Free AccessWen J. Li, Xiaobo Zhang, Xinyu Meng, Yixiong Gao, Shuyu Fan, Tijun Li, Paul Kim Ho Chu (2024). Effects and modulation mechanism of crystal structure on residual stress of Cu films used for metallization. , 807, DOI: https://doi.org/10.1016/j.tsf.2024.140556.
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Type
Article
Year
2024
Authors
7
Datasets
0
Total Files
0
Language
en
DOI
https://doi.org/10.1016/j.tsf.2024.140556
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