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  5. Cell Encapsulation in Sub-mm Sized Gel Modules Using Replica Molding

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Article
en
2008

Cell Encapsulation in Sub-mm Sized Gel Modules Using Replica Molding

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en
2008
Vol 3 (5)
Vol. 3
DOI: 10.1371/journal.pone.0002258

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George M M Whitesides
George M M Whitesides

Harvard University

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Alison P. McGuigan
Derek A. Bruzewicz
Ana C. Glavan
+2 more

Abstract

For many types of cells, behavior in two-dimensional (2D) culture differs from that in three-dimensional (3D) culture. Among biologists, 2D culture on treated plastic surfaces is currently the most popular method for cell culture. In 3D, no analogous standard method--one that is similarly convenient, flexible, and reproducible--exists. This paper describes a soft-lithographic method to encapsulate cells in 3D gel objects (modules) in a variety of simple shapes (cylinders, crosses, rectangular prisms) with lateral dimensions between 40 and 1000 microm, cell densities of 10(5)-10(8) cells/cm(3), and total volumes between 1x10(-7) and 8x10(-4) cm(3). By varying (i) the initial density of cells at seeding, and (ii) the dimensions of the modules, the number of cells per module ranged from 1 to 2500 cells. Modules were formed from a range of standard biopolymers, including collagen, Matrigel, and agarose, without the complex equipment often used in encapsulation. The small dimensions of the modules allowed rapid transport of nutrients by diffusion to cells at any location in the module, and therefore allowed generation of modules with cell densities near to those of dense tissues (10(8)-10(9) cells/cm(3)). This modular method is based on soft lithography and requires little special equipment; the method is therefore accessible, flexible, and well suited to (i) understanding the behavior of cells in 3D environments at high densities of cells, as in dense tissues, and (ii) developing applications in tissue engineering.

How to cite this publication

Alison P. McGuigan, Derek A. Bruzewicz, Ana C. Glavan, Manish J. Butte, George M M Whitesides (2008). Cell Encapsulation in Sub-mm Sized Gel Modules Using Replica Molding. , 3(5), DOI: https://doi.org/10.1371/journal.pone.0002258.

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Publication Details

Type

Article

Year

2008

Authors

5

Datasets

0

Total Files

0

Language

en

DOI

https://doi.org/10.1371/journal.pone.0002258

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